Style: WSON86X5 This compact, leadless 8pin WSON package is designed for surfacemount integration on space constrained PCBs. The footprint measures approximately 6.0 by 5.0 mm, providing a small, reliable option for dense electronics designs. Key benefits Space saving: 6x5 mm footprint enables density board layouts. Easy SMT assembly: compatible with standard reflow soldering processes. Versatile IC compatibility: suitable for a range of 8pin devices that use a WSON8 footprint. Reliable smallformfactor performance: robust connection in a compact package. Durable construction: built with standard WSON packaging materials suitable for electronics manufacturing. Attributes and specifications Package type: WSON8 Footprint: approximately 6 x 5 mm Pin count: 8 Lead style: leadless Form factor: lowprofile Material: standard WSON packaging materials used for electronics assembly Performance and suitability Lowprofile, compact packaging supports slim device designs. Suitable for dense electronic assemblies where board space is at a . Provides dependable electrical performance in tightly packed layouts. Use scenarios Scenario 1: Integrate into wearable devices such as fitness trackers where a small IC package helps minimize the overall device thickness. Scenario 2: Use in compact IoT sensors and smart home modules that require an 8pin WSON footprint for space efficiency. Scenario 3: Employ in handheld consumer electronics for small power management ICs or auxiliary interface ICs that benefit from a compact, leadless package.