A solderless adapter that makes testing TQFP32 chips quick and straightforward in a DIP28 environment. It fits in standard test rigs and reduces setup time during prototyping and evaluation. Key features - Material and build: ABS plastic for durability; precisely aligned holes ensure a stable, solder-free connection every time. - Functionality: converts a TQFP32 package to a DIP28 footprint for reliable testing and evaluation without soldering. - Compatibility and performance: designed for repeatable contact and easy interchange with common DIP28 sockets and development setups. Why you need it - Speeds up development cycles by letting you test chips without PCB soldering or rework. - Protects devices and boards from heat damage associated with soldering. - Reusable across projects, offering a flexible bridge between QFP and DIP-based test rigs. Typical uses - Prototyping: quickly swap in TQFP32 devices to validate circuit behavior on your test bench. - Education: demonstrate IC testing workflows in classroom or lab environments with a clear, hands-on example. - Evaluation: bench-test new TQFP32-based designs before committing to PCB assembly. Notes - Compact and lightweight for easy transport and storage. - Clear, professional design suited for labs, workshops, and educational facilities.