The UC285T_TTT1 is a singleunit device packaged in a TO2635 (fivelead) surfacemount package. Each contains one piece. This part is designed to fit compact power modules and boards where efficient heat dissipation and a small footprint are important. Key benefits and why you need it Compact power solution: TO2635 packaging provides a compact, surfacemount form factor with a mounting tab to aid heat dissipation, helping to keep your board footprint small without sacrificing performance. Easy integration: The TO2635 footprint is widely used in power management designs, enabling straightforward PCB layout and reliable solder connections. Reliable performance in tight spaces: The tab and fivelead configuration support solid electrical and thermal paths, making this device suitable for demanding power applications while maintaining a lowprofile profile. Versatile compatibility: The UC285T_TTT1 is designed to be compatible with standard TO2635 land patterns, facilitating straightforward substitutions or design iterations in existing product lines. Key attributes Functionality: UC285T_TTT1 in a TO2635 package for surfacemount power applications. Package: TO2635 (fivelead configuration with a central mounting tab) suitable for current, density layouts. Size and form factor: Compact, lowprofile surfacemount package optimized for spaceconstrained designs. Material and construction: Epoxymolded power device package with robust mechanical integrity for PCB mounting. Performance orientation: Designed for reliable operation in applications requiring efficient heat dissipation and compact packaging. Compatibility: Standard TO2635 footprint and pin arrangement to support easy integration or replacement in compatible designs. What makes it unique The combination of a fivelead TO2635 package with a single UC285T_TTT1 device provides a streamlined, density power solution ideal for spaceconstrained boards. The integrated tab enhances thermal management, enabling better heat transfer from the die to the PCB environment compared with smaller or flatter packages. Its straightforward, common package type supports quick design iterations and easy replacement in existing TO2635 powered systems. Applications and use cases Power supply modules and DCDC converter boards: Use in compact regulator stages where space is at a and reliable thermal performance is required. Motor control and drive circuits in small to midsize equipment: Suitable for powerhandling sections that benefit from a compact, surfacemount power device. Consumer electronics and automotive electronics where board real estate is limited: Ideal for applications demanding a rugged, mountable power component with a simple footprint. Practical guidance Ensure the board uses a standard TO2635 footprint and compatible land patterns for proper soldering and mechanical reliability. Verify that the device orientation and pinout align with your existing design or replacement requirements before deployment. Consider thermal management in enclosure and PCB design to maximize the benefits of the mounting tab for heat dissipation. This description preserves the brand and model details, and presents clear, customerfriendly information about the UC285T_TTT1 in TO2635, including its benefits, attributes, and typical applications.