The SOP8150mil package is an eight pin small outline package with a body width of 150 mil, designed for surface mount assembly. Key benefits Standard SOP8 footprint provides broad compatibility with a wide range of ICs and PCB designs Compact 150 mil body size saves board space while maintaining reliable lead spacing Plastic encapsulated packaging offers mechanical protection and reliable solder joints during standard reflow processes Clear pinout and consistent package geometry help reduce assembly errors Attributes Package type: SOP8 Body width: 150 mil Pins: 8 Mounting: surface mount Material: plastic encapsulation Performance and reliability Compatible with common automated assembly and reflow processes Provides reliable mechanical support and electrical connection for typical ICs in its class Suited for general purpose ICs where space, footprint, and standardization are important Applications and use scenarios Scenario 1: DIP8 components on a compact printed circuit board to save space and enable automated surface mount assembly Scenario 2: Integrate opamps, voltage regulators, or buffer ICs in space constrained analog or mixed signal circuits Scenario 3: Upgrade legacy designs to a surface mount SOP8 package to improve manufacturability and enable higher automation in production