Slope design: Innovative slope design makes the chip fit better and is compatible with thinner chip ICs. The pads are not suspended and are more uniform. Good compatibility: suitable for chips with thickness below 0.9mm, most current mobile phone chips are assisted in tin implantation Strong expandability: Suitable for steel mesh with size above 50mm. Supports Easy Repair Single CPU Network, Comprehensive Network, CPU Comprehensive Network, etc. Silicone material: It can withstand high temperatures and has good thermal insulation effect. The insulation pad has adhesive properties and is non-slip and does not shift. and not detormed: good resilience, can be curled at will, and will not decay or deform after long-term use Maintenance tin implantation pad is suitable for tin implantation of BGA chips of for Android mobile phones Tips:The product may be updated constantly ,Due To Different Batches, The Actual Product May Have Slight Differences Or Color Differences, Which Does Not Affect Use Colour:As Shown Material:Silica gel Package Contents: 1 * Repair tin pad Only the above package content, other products are not included. Note: Light reflection and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.