Feature: 1. COMPREHENSIVE MOTION SENSING CAPABILITY: Integrated 3 axis gyroscope, 3 axis accelerometer, and 3 axis magnetic field sensor accurately capture a full range of motion changes, including rotation, acceleration, and direction. 2. HIGH ACCURACY, PROGRAMMABILITY: Gyroscope features programmable full range rates (±250 DPS, ±500 DPS, ±1000 DPS, and ±2000 DPS), and accelerometer has selectable ±2 g, ±4 g, ±8 g, and ±16 g ranges, as well as a wide range of magnetic field measurements up to ±4900 μT, ensuring accuracy and flexibility in a wide variety of application environments. 3. BUILT IN DIGITAL DIGITAL MOTION PROCESSOR (DMP): Provides advanced data processing functions that reduce the load on the main processor for more efficient data analysis and real‑time motion detection. 4. INTEGRATED INTEGRATED TEMPERATURE SENSOR: Provides ambient temperature data and helps calibrate and compensate for motion data, enhancing overall system reliability. 5. ADVANCED MEMS PACKAGE TECHNOLOGY: The use of wafer level hermetic sealing and bonding technology can effectively improve the stability and durability of the sensor. Specification: Item Type: MEMS Motion Tracking Sensor Module Material: PCB 3 Axis Gyroscope: Programmable FSR +250 DPS, +500 DPS, +250 DPS And +2000 DPS 3 Axis Accelerometer: Programmable FSR ±2g, ±4g, ±8g And ±16g 3 Axis Magnetic Field: Wide Range To ±4900μt Features: On Board Digital Motion Processor (DMP). Auxiliary I2C Interface For External Sensors. On Chip 16 Bit ADC And Programmable Filters. 7 MHz SPI Or 400 kHz Fast Mode I Square C. Digital Output Temperature Sensor. MEMS Structure Hermetically Sealed And Bonded At Wafer Level. Support For Android.. Package List: 1 x MEMS Motion Tracking Sensor Module1 x Pin