- The socket design ensures safe and essential conditions for accurate chip testing and efficient performance during extended aging tests. - Streamline your chip testing workflows with the Burn-In socket, offering compatibility with QFP64, LQFP64, and TQFP64 package chips for consistent and reliable results. - Ideal for electronics manufacturing workshops conducting batch aging tests and laboratories focused on chip performance verification and long-term stability. - Guarantees precise testing and aging of QFP64, LQFP64, and TQFP64 chips with the Burn-In socket, ensuring stability and reliability throughout the testing process. Key Benefits: - Enhances testing accuracy and efficiency, reducing the risk of faulty chips. - Simplifies integration into existing workflows with dedicated compatibility for multiple chip package types. - Supports both production and development environments by ensuring high-quality assessment of chip performance. Practical Applications: - Use in high-volume production lines where batch testing of electronic components is critical. - Employ in R&D labs for evaluating the performance and durability of new chip designs under stress conditions. - Implement in quality control processes to ensure all components meet rigorous standards before deployment.