No-Clean Desoldering Wick Our No-Clean desoldering braid is made from ultrafine braided copper, designed for precise and reliable solder removal. Sizes (length x width) - 1.5 m x 1.5 mm - 1.5 m x 3.0 mm - 1.5 m x 3.5 mm - 3.0 m x 2.0 mm - 3.0 m x 3.0 mm - 3.0 m x 4.0 mm Key benefits - No-clean design: flux residues are suitable for environments where cleaning may be minimized. - Strong capillary action: absorbs and draws excess solder away from joints for cleaner desoldering. - High thermal conductivity: requires less heat input, helping protect pads, pads, and nearby components. - Efficient and fast: the fine geometric design directs molten solder quickly and effectively. - Protective performance: reduces the risk of damaging pads, solder points, or PCB components during rework. - Versatile sizing: multiple length and width options to fit different joint types and applications. What it solves - Minimizes heat exposure to sensitive PCB areas, reducing the chance of pad lifting or component damage. - Improves speed and reliability of desoldering tasks, especially on fine-pitch or densely populated boards. - Reduces cleanup steps in no-clean environments, simplifying repair and prototyping workflows. Applications and use scenarios - Reworking dense surface-mount devices (SMDs) on compact PCBs, where precise heat control is essential. - Desoldering through-hole components or connectors with minimal impact on adjacent pads and traces. - General repair, prototyping, and maintenance tasks that require efficient solder removal and clean results.